Fundamentals Of Electromigration Aware Integrated Circuit Design PDF Books

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Fundamentals Of Electromigration Aware Integrated Circuit Design

Fundamentals Of Electromigration Aware Integrated Circuit Design
Author: Jens Lienig
Publisher: Springer
ISBN: 3319735586
Size: 73.33 MB
Format: PDF, Kindle
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The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Fundamentals of Electromigration-Aware Integrated Circuit Design
Language: en
Pages: 159
Authors: Jens Lienig, Matthias Thiele
Categories: Technology & Engineering
Type: BOOK - Published: 2018-02-23 - Publisher: Springer
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Long-Term Reliability of Nanometer VLSI Systems
Language: en
Pages: 460
Authors: Sheldon Tan, Mehdi Tahoori, Taeyoung Kim, Shengcheng Wang, Zeyu Sun, Saman Kiamehr
Categories: Technology & Engineering
Type: BOOK - Published: 2019-09-12 - Publisher: Springer Nature
This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques. Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models; Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects; Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels; Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors
Dependable Embedded Systems
Language: en
Pages: 608
Authors: Jörg Henkel, Nikil Dutt
Categories: Technology & Engineering
Type: BOOK - Published: 2020-12-09 - Publisher: Springer Nature
This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.
The Art of Timing Closure
Language: en
Pages: 204
Authors: Khosrow Golshan
Categories: Technology & Engineering
Type: BOOK - Published: 2020-08-03 - Publisher: Springer Nature
The Art of Timing Closure is written using a hands-on approach to describe advanced concepts and techniques using Multi-Mode Multi-Corner (MMMC) for an advanced ASIC design implementation. It focuses on the physical design, Static Timing Analysis (STA), formal and physical verification. The scripts in this book are based on Cadence® Encounter SystemTM. However, if the reader uses a different EDA tool, that tool’s commands are similar to those shown in this book. The topics covered are as follows: Data Structures Multi-Mode Multi-Corner Analysis Design Constraints Floorplan and Timing Placement and Timing Clock Tree Synthesis Final Route and Timing Design Signoff Rather than go into great technical depth, the author emphasizes short, clear descriptions which are implemented by references to authoritative manuscripts. It is the goal of this book to capture the essence of physical design and timing analysis at each stage of the physical design, and to show the reader that physical design and timing analysis engineering should be viewed as a single area of expertise. This book is intended for anyone who is involved in ASIC design implementation -- starting from physical design to final design signoff. Target audiences for this book are practicing ASIC design implementation engineers and
3D Microelectronic Packaging
Language: en
Pages: 622
Authors: Yan Li, Deepak Goyal
Categories: Technology & Engineering
Type: BOOK - Published: 2020-11-23 - Publisher: Springer Nature
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Algorithmen und Datenstrukturen im VLSI-Design
Language: de
Pages: 286
Authors: Christoph Meinel, Thorsten Theobald
Categories: Computers
Type: BOOK - Published: 2013-03-07 - Publisher: Springer-Verlag
Eines der Hauptprobleme beim Chipentwurf besteht darin, daß die Anzahl der zu bewältigenden Kombinationen der einzelnen Chipbausteine ins Unermeßliche steigt. Hier hat sich eine sehr fruchtbare Verbindung zu einem Kerngebiet der Theoretischen Informatik, dem Gebiet des Entwurfs von Datenstrukturen und effizienten Algorithmen, herstellen lassen: das Konzept der geordneten binären Entscheidungsgraphen, das in zahlreichen CAD-Projekten zu einer beträchtlichen Leistungssteigerung geführt hat. Die Autoren stellen die Grundlagen dieses interdisziplinären Forschungsgebiets dar und behandeln wichtige Anwendungen aus dem rechnergestützten Schaltkreisentwurf.
Applikationshandbuch Leistungshalbleiter
Language: de
Pages: 452
Authors: Christoph Meinel, Thorsten Theobald
Categories: Computers
Type: BOOK - Published: 2015 - Publisher:
Books about Applikationshandbuch Leistungshalbleiter
Integrated Circuit Processes
Language: en
Pages: 42
Authors: Christoph Meinel, Thorsten Theobald
Categories: Integrated circuits
Type: BOOK - Published: 1975 - Publisher:
Books about Integrated Circuit Processes
Finite-Elemente-Analyse von modernen Leitbahnsystemen
Language: en
Pages: 248
Authors: Hiltrud Brocke
Categories: Integrated circuits
Type: BOOK - Published: 2005 - Publisher:
Books about Finite-Elemente-Analyse von modernen Leitbahnsystemen
Nanophysik und Nanotechnologie
Language: de
Pages: 328
Authors: Edward L. Wolf
Categories: Technology & Engineering
Type: BOOK - Published: 2015-07-31 - Publisher: John Wiley & Sons
Noch hat das Motto “Alles muss kleiner werden” nicht an Faszination verloren. Physikern, Ingenieuren und Medizinern erschließt sich mit der Nanotechnologie eine neue Welt mit faszinierenden Anwendungen. E.L. Wolf, Physik-Professor in Brooklyn, N.Y., schrieb das erste einführende Lehrbuch zu diesem Thema, in dem er die physikalischen Grundlagen ebenso wie die Anwendungsmöglichkeiten der Nanotechnologie diskutiert. Mittlerweile ist es in der 3. Aufl age erschienen und liegt jetzt endlich auch auf Deutsch vor. Dieses Lehrbuch bietet eine einzigartige, in sich geschlossene Einführung in die physikalischen Grundlagen und Konzepte der Nanowissenschaften sowie Anwendungen von Nanosystemen. Das Themenspektrum reicht von Nanosystemen über Quanteneff ekte und sich selbst organisierende Strukturen bis hin zu Rastersondenmethoden. Besonders die Vorstellung von Nanomaschinen für medizinische Anwendungen ist faszinierend, wenn auch bislang noch nicht praktisch umgesetzt. Der dritten Aufl age, auf der diese Übersetzung beruht, wurde ein neuer Abschnitt über Graphen zugefügt. Die Diskussion möglicher Anwendungen in der Energietechnik, Nanoelektronik und Medizin wurde auf neuesten Stand gebracht und wieder aktuelle Beispiele herangezogen, um wichtige Konzepte und Forschungsinstrumente zu illustrieren. Der Autor führt mit diesem Lehrbuch Studenten der Physik, Chemie sowie Ingenieurwissenschaften von den Grundlagen bis auf den Stand der aktuellen Forschung. Die leicht zu lesende Einführung in dieses faszinierende Forschungsgebiet